TY - JOUR UR - http://lib.ugent.be/catalog/pug01:675653 ID - pug01:675653 LA - eng TI - A fixed-angle dynamic heat spreading model for (an)isotropic rear-cooled substrates PY - 2008 JO - (2008) JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME SN - 0022-1481 PB - 2008 AU - Vermeersch, Bjorn TW06 801002020384 002000063309 AU - De Mey, Gilbert AB - During a period of almost 40 years already, various fixed-angle heat spreading models have been developed in the literature. These models are commonly used by thermal engineers as approximations for the thermal steady-state resistance of a heat source on a rear-cooled substrate. In this paper, an extension of these models to dynamic (time-dependent) phenomena is proposed. The heat dissipated by a square source (side a) is assumed to spread out into the substrate (thickness b) under an angle phi. An analytical solution for the complex thermal impedance Zth(j*omea) in phasor notation is derived. The obtained expression, in which phi is used as a fitting parameter, is compared with accurate analytical results. A very good agreement is observed (average relative error less than 6%) for a wide range of the normalized thickness lambda = b / a. A compact expression for the optimal heat spreading angle as a function of lambda is given. Also the temperature response to a heat power step is investigated, and a simple formula for the thermal rise time is provided. Finally, the model can be easily extended to anisotropic media, which often appear in electronic packaging applications. Overall the proposed model allows a thermal designer to make quick yet accurate estimations about the dynamic behavior of the device. ER -Download RIS file
00000nam^a2200301^i^4500 | |||
001 | 675653 | ||
005 | 20161219154112.0 | ||
008 | 090602s2008------------------------eng-- | ||
022 | a 0022-1481 | ||
024 | a 000262842200002 2 wos | ||
024 | a 1854/LU-675653 2 handle | ||
024 | a 10.1115/1.2976557 2 doi | ||
040 | a UGent | ||
245 | a A fixed-angle dynamic heat spreading model for (an)isotropic rear-cooled substrates | ||
260 | c 2008 | ||
520 | a During a period of almost 40 years already, various fixed-angle heat spreading models have been developed in the literature. These models are commonly used by thermal engineers as approximations for the thermal steady-state resistance of a heat source on a rear-cooled substrate. In this paper, an extension of these models to dynamic (time-dependent) phenomena is proposed. The heat dissipated by a square source (side a) is assumed to spread out into the substrate (thickness b) under an angle phi. An analytical solution for the complex thermal impedance Zth(j*omea) in phasor notation is derived. The obtained expression, in which phi is used as a fitting parameter, is compared with accurate analytical results. A very good agreement is observed (average relative error less than 6%) for a wide range of the normalized thickness lambda = b / a. A compact expression for the optimal heat spreading angle as a function of lambda is given. Also the temperature response to a heat power step is investigated, and a simple formula for the thermal rise time is provided. Finally, the model can be easily extended to anisotropic media, which often appear in electronic packaging applications. Overall the proposed model allows a thermal designer to make quick yet accurate estimations about the dynamic behavior of the device. | ||
598 | a A1 | ||
100 | a Vermeersch, Bjorn u TW06 0 801002020384 0 002000063309 0 056376424854 | ||
700 | a De Mey, Gilbert u TW06 0 801000310861 | ||
650 | a Technology and Engineering | ||
653 | a microelectronics | ||
653 | a anisotropy | ||
653 | a THERMAL-RESISTANCE | ||
653 | a fixed-angle model | ||
653 | a heat spreading | ||
653 | a thermal conduction | ||
653 | a dynamic | ||
773 | t JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME g J. Heat Transf.-Trans. ASME. 2008. 130 (12) p.121301-1-121301-9 q 130:12<121301-1 | ||
856 | 3 Full Text u https://biblio.ugent.be/publication/675653/file/710470 z [ugent] y Vermeersch_2008_JHT_130_12_121301.pdf | ||
920 | a article | ||
852 | x EA b TW06 | ||
922 | a UGENT-EA |
All data below are available with an Open Data Commons Open Database License. You are free to copy, distribute and use the database; to produce works from the database; to modify, transform and build upon the database. As long as you attribute the data sets to the source, publish your adapted database with ODbL license, and keep the dataset open (don't use technical measures such as DRM to restrict access to the database).
The datasets are also available as weekly exports.